Platform for the Accelerated Realization, Analysis, & Discovery of Interface Materials

2017 REU PROGRAM

PARADIM, the Platform for the Accelerated Realization, Analysis, and Discovery of Interface Materials is a new national user facility at Cornell dedicated to the discovery and fabrication of new materials with unprecedented properties. The specific materials involved are ultra-thin layers of transition metal dichalcogenides and transition metal oxides only a few atoms thick. Their novel properties have attracted great interest for potential applications as next generation electronic materials. Our 2017 REU Program will give five undergraduate students an introductory research experience growing or characterizing these films with great precision and state-of-the-art facilities. The films will be grown using molecular-beam epitaxy (MBE) and metal-organic chemical vapor deposition (MOCVD) systems in the new PARADIM thin film research facility. Their atomic structure will be mapped using modern scanning transmission electron microscopes in the CCMR research facility.

PARADIM REU interns will receive a $5,000 stipend, housing, and up to $500 in qualified travel expenses. There are social gatherings and reasonably priced bus trips to NYS and Niagara Falls (optional/not a part of your financial package) designed to help you meet and make friends with the other ~100 REU students at Cornell. While we do not provide a meal plan, a great deal of free food is regularly available!

The 2017 program runs Tuesday, June 6th – Friday, August 11th, with interns arriving in Ithaca on June 3rd and departing on August 12th. This ten-week introduction to a scientific research career will culminate with a convocation to held jointly with the REU students from the Cornell NanoScale Facility (CNF). Each intern will give a final presentation and write a two-page report, due on August 12th, that will be posted on the PARADIM website. Projects are scaled to be challenging yet achievable within the program time frame.

Go to PARADIM REU Program Application